Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process.
Kim BH, Lee J, Won SM, Xie Z, Chang JK, Yu Y, Cho YK, Jang H, Jeong JY, Lee Y, Ryu A, Kim DH, Lee KH, Lee JY, Liu F, Wang X, Huo Q, Min S, Wu D, Ji B, Banks A, Kim J, Oh N, Jin HM, Han S, Kang D, Lee CH, Song YM, Zhang Y, Huang Y, Jang KI, Rogers JA.
Kim BH, et al. Among authors: han s.
ACS Nano. 2018 May 22;12(5):4164-4171. doi: 10.1021/acsnano.8b00180. Epub 2018 Apr 17.
ACS Nano. 2018.
PMID: 29641889
Free PMC article.