In-line NIR coupled with machine learning to predict mechanical properties and dissolution profile of PLA-Aspirin

Funct Compos Mater. 2024;5(1):14. doi: 10.1186/s42252-024-00063-5. Epub 2024 Oct 8.

Abstract

In the production of polymeric drug delivery devices, dissolution profile and mechanical properties of the drug loaded polymeric matrix are considered important Critical Quality Attributes (CQA) for quality assurance. However, currently the industry relies on offline testing methods which are destructive, slow, labour intensive, and costly. In this work, a real-time method for predicting these CQAs in a Hot Melt Extrusion (HME) process is explored using in-line NIR and temperature sensors together with Machine Learning (ML) algorithms. The mechanical and drug dissolution properties were found to vary significantly with changes in processing conditions, highlighting that real-time methods to accurately predict product properties are highly desirable for process monitoring and optimisation. Nonlinear ML methods including Random Forest (RF), K-Nearest Neighbours (KNN) and Recursive Feature Elimination with RF (RFE-RF) outperformed commonly used linear machine learning methods. For the prediction of tensile strength RFE-RF and KNN achieved R 2 values 98% and 99%, respectively. For the prediction of drug dissolution, two time points were considered with drug release at t = 6 h as a measure of the extent of burst release, and t = 96 h as a measure of sustained release. KNN and RFE-RF achieved R 2 values of 97% and 96%, respectively in predicting the drug release at t = 96 h. This work for the first time reports the prediction of drug dissolution and mechanical properties of drug loaded polymer product from in-line data collected during the HME process.

Supplementary information: The online version contains supplementary material available at 10.1186/s42252-024-00063-5.

Keywords: Dissolution profile; Drug delivery systems; Machine learning; Mechanical properties; PAT; Polymeric drug delivery; Real-time monitoring.